High-frequency module
AssigneeMurata Manufacturing Co., Ltd.
InventorTakanori Uejima
Life of this patent
Estimating the term…
Abstract
A high-frequency module includes a branching circuit element, a multilayer substrate, and a shield conductor. The branching circuit element includes transmission and receiving terminals and is disposed on a surface of the multilayer substrate. The shield conductor is disposed on the side of the surface of the multilayer substrate and covers the branching circuit element. The transmission and receiving terminals are disposed with respect to the shield conductor such that a signal in at least a portion of the frequency band of a first signal, which is transmitted from the transmission terminal, is cancelled by a second signal at the receiving terminal.
Claims20
A high-frequency module comprising:
- a surface mount element including a first mounting terminal and a second mounting terminal;
- a multilayer substrate at which the surface mount element is disposed;
- and
- a shield conductor that is disposed on a side of a surface of the multilayer substrate, covers the surface mount element, and is spaced apart from the surface mount element;
- wherein
- when a high-frequency signal that passes through between the second mounting terminal and the first mounting terminal is defined as a first signal and a high-frequency signal that transmits from the second mounting terminal to the first mounting terminal via the shield conductor is defined as a second signal, the first mounting terminal and the second mounting terminal are disposed with respect to the shield conductor such that a signal in at least a portion of a frequency band of the first signal is canceled by the second signal at the first mounting terminal.
A high-frequency module comprising:
- a surface mount element including a transmission terminal, a receiving terminal, and a common terminal;
- a multilayer substrate at which the surface mount element is disposed;
- and
- a shield conductor that is disposed on a side of a surface of the multilayer substrate, covers the surface mount element, and is spaced apart from the surface mount element;
- wherein
- the multilayer substrate includes a matching circuit element connected to the common terminal;
- a high-frequency signal that is leaked from the transmission terminal to the receiving terminal is defined as a first signal and a high-frequency signal that transmits from the common terminal to the receiving terminal via the matching circuit element and the shield conductor is defined as a second signal;
- and
- the receiving terminal and the matching circuit element are disposed with respect to the shield conductor such that a signal in at least a portion of a frequency band of the first signal is cancelled by the second signal at the receiving terminal.
Dependencies are inferred from the claim text.