Electronic assembly for lighting applications, lighting device and method for producing an electronic assembly

A lighting device comprising an electronic assembly,

• the electronic assembly comprising:
• a printed circuit board having a first printed circuit board surface, which is designed for populating with electronic components, and a second printed circuit board surface opposite the first printed circuit board surface, wherein the printed circuit board has a continuous cutout from the first printed circuit board surface to the second printed circuit board surface;
• a heat distributor having at least one first contact surface and at least one second contact surface opposite the first contact surface, wherein the first contact surface is connected in a material-bonded manner to the printed circuit board arranged in parallel therewith at the second printed circuit board surface;
• and
• at least one first light emitting diode element, which is arranged on a section of the first contact surface, which section is exposed within the cutout, and is connected in a material-bonded manner to the first contact surface;
• wherein the heat distributor is of segmented form, comprising at least one first heat distribution segment having the first contact surface and the second contact surface and a second heat distribution segment having a third contact surface and a fourth contact surface opposite the third contact surface;
• wherein a second light emitting diode element is arranged on a section of the third contact surface, which section is exposed within the same cutout or a further cutout of the printed circuit board, and connected to the third contact surface in a material-bonded manner.

A method for producing an electronic assembly for lighting applications, the method comprising:

• providing a printed circuit board having a first printed circuit board surface, which at least one of is designed for populating with electronic components or is populated with electronic components, and a second printed circuit board surface opposite the first printed circuit board surface, wherein the printed circuit board has a continuous cutout from the first printed circuit board surface to the second printed circuit board surface;
• connecting a heat distributor, which has at least one first contact surface and at least one second contact surface opposite the first contact surface, at the first contact surface in a material-bonded manner to the printed circuit board arranged in parallel therewith at the second printed circuit board surface;
• arranging at least one first light emitting diode element on a section of the first contact surface, which section is exposed within the cutout;
• and
• connecting the at least one first light emitting diode element in a material-bonded manner to the first contact surface;
• providing the heat distributor in segmented form, comprising at least one first heat distribution segment having the first contact surface and the second contact surface and a second heat distribution segment having a third contact surface and a fourth contact surface opposite the third contact surface;
• arranging a second light emitting diode element on a section of the third contact surface, which section is exposed within the same cutout or a further cutout of the printed circuit board, and connected to the third contact surface in a material-bonded manner.