Hybrid component carrier and method for manufacturing the same

A component carrier, comprising:

• a first layer structure having at least one electrically insulating layer and at least one electrically conductive layer;
• and
• a second layer structure on the first layer structure,
• wherein the second layer structure comprises at least a first layer and a second layer,
• wherein the first layer structure has a first density of electrically conductive elements,
• wherein the second layer structure has a second density of electrically conductive elements,
• wherein the second density of electrically conductive elements is greater than the first density of electrically conductive elements,
• wherein the first layer of the second layer structure is formed on the first layer structure,
• wherein the second layer of the second layer structure is formed on the first layer of the second layer structure,
• wherein the first density of electrically conductive elements and the second density of electrically conductive elements is defined by the number of electrically conductive elements per unit of volume,
• wherein at least one heat dissipation pathway for dissipating heat from the second layer structure to the first layer structure is formed.