Assembly of integrated circuit modules and method for identifying the modules
AssigneeImec Vzw
InventorsRoeland Vandebriel, Geert Van der Plas, Vladimir Cherman
Life of this patent
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AssigneeImec Vzw
InventorsRoeland Vandebriel, Geert Van der Plas, Vladimir Cherman
Estimating the term…
An assembly including a carrier substrate and at least one group of interconnected integrated circuit modules mounted thereon is disclosed. The modules are provided with a connection for transmitting a clock signal through the group of interconnected modules. The modules are also provided with digital input ports and output ports and a logic circuit configured for identifying the position of the modules in the group on the basis of a count of the clock pulses, and on the basis of the logic state of the input and output ports. In one aspect, a method involves the transfer of a token in the form of one or more logic states, through the group of modules, from a first module to a last module, resulting in the identification of all modules in a progressive manner.
An assembly comprising a carrier substrate and on the substrate one or more groups of interconnected integrated circuit modules, each group comprising a first module, a last module, and one or more intermediate modules, wherein each module comprises:
Dependencies are inferred from the claim text.