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US 10,381,940 B2Granted
Rectifier IC and isolated switching power supply using same
AssigneeRohm Co., Ltd.
InventorHiroki Kikuchi
Life of this patent
Estimating the term…
Abstract
A rectifier IC seals, in a single package, a first transistor chip which integrates a first transistor, a second transistor chip which integrates a second transistor and a controller chip which detects a first node voltage and a second node voltage of each of the transistors so as to perform on/off control on the transistors, and the rectifier IC functions as a secondary-side rectification means of an isolated switching power supply.
Claims30
A rectifier IC comprising:
- a first transistor chip including a first transistor;
- a second transistor chip including a second transistor;
- a controller chip operable to detect a first node voltage and a second node voltage of each of the transistors so as to perform on/off control on both of the transistors;
- a first lead frame on which the first transistor chip is mounted;
- a second lead frame on which the second transistor chip is mounted;
- a die pad on which the controller chip is mounted;
- a third lead frame connected to a source of the first transistor;
- and
- a fourth lead frame connected to a source of the second transistor,
- wherein the rectifier IC functions as a secondary-side rectifier of an isolated switching power supply,
- wherein the first transistor chip, the second transistor chip and the controller chip are sealed in a single package,
- wherein the first and second lead frames are led out of the package at a first side thereof, and the third and fourth lead frames are led out of the package at a second side thereof, and
- wherein the third and fourth lead frames are arranged at opposite ends, respectively, of the second side of the package.
10 more elements
An isolated switching power supply comprising:
- a secondary-side rectifier of a transformer,
- wherein the secondary-side rectifier includes a rectifier IC, the rectifier IC comprising:
- a first transistor chip including a first transistor;
- a second transistor chip including a second transistor;
- a controller chip operable to detect a first node voltage and a second node voltage of each of the transistors so as to perform on/off control on both of the transistors;
- a first lead frame on which the first transistor chip is mounted;
- a second lead frame on which the second transistor chip is mounted;
- a die pad on which the controller chip is mounted;
- a third lead frame connected to a source of the first transistor;
- and
- a fourth lead frame connected to a source of the second transistor,
- wherein the first transistor chip, the second transistor chip and the controller chip are sealed in a single package,
- wherein the first and second lead frames are led out of the package at a first side thereof, and the third and fourth lead frames are led out of the package at a second side thereof, and
- wherein the third and fourth lead frames are arranged at opposite ends, respectively, of the second side of the package.
11 more elements
A rectifier IC comprising:
- a first transistor chip including a first transistor;
- a second transistor chip including a second transistor;
- a first controller chip operable to detect a first node voltage and a second node voltage of the first transistor so as to perform on/off control on the first transistor;
- a second controller chip operable to detect a third node voltage and a fourth node voltage of the second transistor so as to perform on/off control on the second transistor;
- a first lead frame on which the first transistor chip is mounted;
- a second lead frame on which the second transistor chip is mounted;
- a first die pad on which the first controller chip is mounted;
- a second die pad on which the second controller chip is mounted;
- a third lead frame connected to a source of the first transistor;
- and
- a fourth lead frame connected to a source of the second transistor,
- wherein the rectifier IC functions as a secondary-side rectifier of an isolated switching power supply,
- wherein the first controller chip and the second controller chip are arranged between the first lead pin and the third lead pin,
- wherein the first transistor chip, the second transistor chip, the first controller chip, and the second controller chip are sealed in a single package,
- wherein the first and second lead frames are led out of the package at a first side thereof, and the third and fourth lead frames are led out of the package at a second side thereof, and
- wherein the third and fourth lead frames are arranged at opposite ends, respectively, of the second side of the package.
13 more elements
Dependencies are inferred from the claim text.