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US 10,381,802 B2Granted
Light emitting device
AssigneePhilips Photonics GmbH
InventorsStephan Gronenborn, Michael Miller, Peter Dannberg, Mark Schuermann, Holger Moench
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AssigneePhilips Photonics GmbH
InventorsStephan Gronenborn, Michael Miller, Peter Dannberg, Mark Schuermann, Holger Moench
Estimating the term…
The invention describes a light emitting device (100). The light emitting device (100) comprises at least one light emitting structure (110), at least one processing layer (120) and at least one optical structure (130). The optical structure (130) comprises at least one material processed by means of processing light (150). The at least one processing layer (120) is arranged to reduce reflection of the processing light (150) in a direction of the optical structure (130) at least by 50%, preferably at least by 80%, more preferably at least by 95% and most preferably at least by 99% during processing of the material by means of the processing light (150). It is a basic idea of the present invention to incorporate a non- or low-reflective processing layer (120) on top of a light emitting structure (110) like a VCSEL array in order to enable on wafer processing of light emitting structures (130) like microlens arrays. The invention further describes a method of manufacturing such a light emitting device (100).
A light emitting device, wherein the light emitting device comprises at least one light emitting structure, at least one processing layer and at least one optical structure, wherein the optical structure comprises at least one material processed by means of processing light, and wherein the at least one processing layer is arranged to reduce reflection of the processing light in a direction of the optical structure at least by 50% during processing of the material by means of the processing light, wherein the processing layer comprises an antireflective coating, wherein the antireflective coating is adapted to transmit the processing light to an absorption structure such that the reflection of the processing light is reduced by absorption by means of the absorption structure, and wherein a thickness of the antireflective coating is adapted such that processing light reflected at a first surface of the antireflective coating nearer to a source of the processing light destructively interferes with processing light reflected at a second surface of the antireflective coating which is directed away from the source of the processing light.
A method of manufacturing a light emitting device, the method comprising the steps of:
Dependencies are inferred from the claim text.