Back to results
US 10,381,801 B1Granted
Device including structure over airgap
AssigneeHewlett Packard Enterprise Development LP
InventorDi Liang
Life of this patent
Estimating the term…
Abstract
A device comprises a substrate, a sacrificial material layer over the substrate, a first solid-state material layer over the sacrificial layer, a dielectric layer over solid-state material layer, and a second solid-state material layer over the dielectric layer. The sacrificial material layer may have an airgap, the solid-state material layer may comprise a structure over the airgap and may be separated from a bulk portion of the first material layer by trenches, where the trenches extend to the airgap.
Claims20
A device, comprising:
- a substrate;
- a sacrificial material layer over the substrate, the sacrificial material layer having an airgap;
- a first solid-state material layer over the sacrificial layer, the solid-state material layer comprising a structure over the airgap and separated from a bulk portion of the first material layer by trenches, the trenches extending to the airgap;
- a dielectric layer over solid-state material layer;
- a second solid-state material layer over the dielectric layer.
2 more elements
A method, comprising:
- forming trenches extending to a sacrificial material layer in a first solid-state material layer such that the trenches define a structure separated from a bulk portion of the first material layer;
- using the trenches to selectively remove a portion of the sacrificial material layer to form an airgap underneath the structure;
- disposing a dielectric layer over the first solid-state material layer;
- and
- bonding a wafer comprising a second solid-state material layer to an assembly comprising the sacrificial material layer and the first solid-state material layer.
2 more elements
Dependencies are inferred from the claim text.