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US 10,381,720 B2Granted
Radio frequency identification (RFID) integrated circuit (IC) and matching network/antenna embedded in surface mount devices (SMD)
AssigneeNXP B.V.
InventorsGiuliano Manzi, Gerald Wiednig
Life of this patent
Estimating the term…
Abstract
A matching network is integrated into a multilayer surface mount device containing an RFID integrated circuit to provide both an antenna and a matching network for the RFID integrated circuit in the ultra high frequency regime. The surface mount device may be mounted on a printed circuit board to provide RF and RFID functionality to the printed circuit board.
Claims18
A device comprising:
- a printed circuit board (PCB);
- and
- a surface mount device (SMD) component that is surface mounted to a surface of the PCB, the SMD component including a multilayer surface mount structure of dielectric layers that are laminated together and an RFID (Radio Frequency Identification) integrated circuit embedded within the multilayer surface mount structure between dielectric layers that are laminated together and electrically coupled to a first end and to a second end of a multilayer inductive coil at respective pads of the RFID integrated circuit, wherein the RFID integrated circuit is embedded between a first dielectric layer that is laminated together to a second dielectric layer, the multilayer inductive coil including a plurality of traces that are vertically distributed within the multilayer surface mount structure between dielectric layers that are laminated together above and below the embedded RFID integrated circuit and electrically coupled together vertically by metalized vias to form the multilayer inductive coil for the RFID integrated circuit, wherein the plurality of traces above and below the embedded RFID integrated circuit and the metalized vias form an uninterrupted conductive path that travels above and below the embedded RFID integrated circuit from the first end to the second end of the multilayer inductive coil.
A device comprising:
- a surface mount device (SMD) component for surface mounting to a surface of a printed circuit board, the SMD component including a multilayer surface mount structure of dielectric layers that are laminated together and an RFID (Radio Frequency Identification) integrated circuit embedded within the multilayer surface mount structure between dielectric layers that are laminated together and electrically coupled to a first end and to a second end of a multilayer inductive coil at respective pads of the RFID integrated circuit, wherein the RFID integrated circuit is embedded between a first dielectric layer that is laminated together to a second dielectric layer, the multilayer inductive coil including a plurality of traces that are vertically distributed within the multilayer surface mount structure between dielectric layers that are laminated together above and below the embedded RFID integrated circuit to form a multilayer inductive coil for the RFID integrated circuit, wherein the plurality of traces above and below the embedded RFID integrated circuit and the metalized vias form an uninterrupted conductive path that travels above and below the embedded RFID integrated circuit from the first end to the second end of the multilayer inductive coil;
- the SMD component further including:
- first, second, third, and fourth external pads on a bottom surface of the SMD component:
- the first and second external pads for connection to one of an inter-integrated circuit (I2C) bus and a data bus;
- two internal microvias that electrically connect pads on the RFID integrated circuit to the first and second external pads;
- the third and fourth external pads for connection to an external antenna;
- and
- two internal microvias that electrically connect pads on the RFID integrated circuit to the third and fourth external pads.
5 more elements
A device comprising:
- a surface mount device (SMD) component for surface mounting to a surface of a printed circuit board (PCB), the SMD component including a multilayer surface mount structure of dielectric layers that are laminated together and an RFID (Radio Frequency Identification) integrated circuit embedded within the multilayer surface mount structure between dielectric layers that are laminated together and electrically coupled to a first end and to a second end of a multilayer inductive coil at respective pads of the RFID integrated circuit, wherein the RFID integrated circuit is embedded between a first dielectric layer that is laminated together to a second dielectric layer, the multilayer inductive coil including a plurality of traces that are vertically distributed within the multilayer surface mount structure between dielectric layers that are laminated together above and below the embedded RFID integrated circuit and electrically coupled together vertically by metalized vias to form the multilayer inductive coil for the RFID integrated circuit, wherein the plurality of traces above and below the embedded RFID integrated circuit and the metalized vias form an uninterrupted conductive path that travels above and below the embedded RFID integrated circuit from the first end to the second end of the multilayer inductive coil.
Dependencies are inferred from the claim text.