Light-emitting device and electronic device
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsShunpei Yamazaki, Shingo Eguchi
Life of this patent
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Abstract
A highly reliable light-emitting device is provided. Damage to an element due to externally applied physical power is suppressed. Alternatively, in a process of pressure-bonding of an FPC, damage to a resin and a wiring which are in contact with a flexible substrate due to heat is suppressed. A neutral plane at which stress-strain is not generated when a flexible light-emitting device including an organic EL element is deformed, is positioned in the vicinity of a transistor and the organic EL element. Alternatively, the hardness of the outermost surface of a light-emitting device is high. Alternatively, a substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected to an FPC.
Claims12
A light-emitting device comprising:
- a pixel portion;
- a first driver circuit;
- a second driver circuit;
- and
- an FPC,
- wherein the pixel portion comprises:
- a transistor over a first flexible substrate;
- a planarization layer over the first flexible substrate and the transistor;
- an organic EL element over the planarization layer, wherein the organic EL element is electrically connected to the transistor;
- an adhesive layer over the planarization layer and the organic EL element;
- and
- a second flexible substrate over the adhesive layer,
- wherein a first thickness from the first flexible substrate to the planarization layer is 0.8 to 1.2 times as large as a second thickness from the second flexible substrate to the adhesive layer,
- wherein the first driver circuit and the second driver circuit are over the first flexible substrate,
- wherein the second driver circuit is provided on an opposite side of the first driver circuit across the pixel portion, and
- wherein the FPC does not comprise a region sandwiched between the first flexible substrate and the second flexible substrate.
A light-emitting device comprising:
- a pixel portion;
- a first driver circuit;
- a second driver circuit;
- and
- an FPC,
- wherein the pixel portion comprises:
- a transistor over a first surface of a first flexible substrate;
- a planarization layer over the first flexible substrate and the transistor;
- an organic EL element over the planarization layer, wherein the organic EL element is electrically connected to the transistor;
- an adhesive layer over the planarization layer and the organic EL element;
- and
- a second flexible substrate over the adhesive layer,
- wherein the first flexible substrate comprises a second surface opposite to the first surface;
- wherein the second flexible substrate comprises a third surface at the adhesive layer side and a fourth surface opposite to the third surface,
- wherein a first distance from an interface between the planarization layer and the adhesive layer to the second surface is 0.8 to 1.2 times as large as a second distance from the interface to the fourth surface,
- wherein the first driver circuit and the second driver circuit are over the first flexible substrate,
- wherein the pixel portion is between the second driver circuit and the first driver circuit, and
- wherein the FPC does not comprise a region sandwiched between the first flexible substrate and the second flexible substrate.
A light-emitting device comprising:
- a pixel portion;
- a first driver circuit;
- a second driver circuit;
- and
- an FPC,
- wherein the pixel portion comprises:
- a transistor over a first flexible substrate;
- a planarization layer over the first flexible substrate and the transistor;
- an organic EL element over the planarization layer, wherein the organic EL element is electrically connected to the transistor;
- an adhesive layer over the planarization layer and the organic EL element;
- and
- a second flexible substrate over the adhesive layer,
- wherein a first thickness from the first flexible substrate to the planarization layer is 0.8 to 1.2 times as large as a second thickness from the second flexible substrate to the adhesive layer,
- wherein a neutral plane is positioned in the planarization layer, in the transistor, in the organic EL element, or near both the transistor and the organic EL element,
- wherein the first driver circuit and the second driver circuit are over the first flexible substrate,
- wherein the second driver circuit is provided on an opposite side of the first driver circuit across the pixel portion, and
- wherein the FPC does not comprise a region sandwiched between the first flexible substrate and the second flexible substrate.
Dependencies are inferred from the claim text.