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US 10,381,562 B1Granted
Method and apparatus for cooling of an electronic device
AssigneeQUALCOMM Incorporated
InventorsJorge Luis Rosales, Victor Chiriac, Sean Charles Andrews
Life of this patent
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Abstract
Some features pertain to an apparatus that includes a first heat spreader and a second heat spreader, a matrixed heat spreader, the matrixed heat spreader including a first plurality of portions perpendicular to a second plurality of portions, the first plurality of portions intersects the second plurality of portions, and a phase change material (PCM) located in a plurality of reservoirs defined by the matrixed heat spreader.
Claims22
An apparatus, comprising:
- a first heat spreader and a second heat spreader;
- a matrixed heat spreader, the matrixed heat spreader including a first plurality of portions perpendicular to a second plurality of portions, the first plurality of portions intersecting the second plurality of portions, wherein the matrixed heat spreader is thermally coupled to an inner side of the first heat spreader, the first heat spreader located over the matrixed heat spreader, and the matrixed heat spreader is thermally coupled to an inner side of the second heat spreader, the second heat spreader located under the matrixed heat spreader;
- a third heat spreader including a third plurality of portions located on, and thermally coupled to the second heat spreader, and a fourth plurality of portions located on, and thermally coupled to the first heat spreader;
- and
- a phase change material (PCM) located in a plurality of reservoirs defined by the matrixed heat spreader.
2 more elements
A method for fabricating an apparatus for cooling an electronic device, comprising:
- forming a first heat spreader and a second heat spreader;
- forming a first plurality of portions and a second plurality of portions of a matrixed heat spreader, the first plurality of portions perpendicular to, and intersecting the second plurality of portions;
- coupling the matrixed heat spreader to an inner side of the first heat spreader, the first heat spreader located over the matrixed heat spreader and coupling the matrixed heat spreader to an inner side of the second heat spreader, the second heat spreader located under the matrixed heat spreader;
- forming a third heat spreader including forming a third plurality of portions located on, and thermally coupled to the second heat spreader, and forming a fourth plurality of portions located on, and thermally coupled to the first heat spreader;
- and
- depositing a phase change material (PCM) to surround the matrixed heat spreader, the PCM located in a plurality of reservoirs defined by the matrixed heat spreader.
3 more elements
Dependencies are inferred from the claim text.