Cryogenic electronic packages and methods for fabricating cryogenic electronic packages
AssigneeMassachusetts Institute of Technology
InventorsRabindra N. Das, Eric A. Dauler
Life of this patent
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Abstract
A cryogenic electronic package includes a first superconducting multi-chip module (SMCM), a superconducting interposer, a second SMCM and a superconducting semiconductor structure. The interposer is disposed over and coupled to the first SMCM, the second SMCM is disposed over and coupled to the interposer, and the superconducting semiconductor structure is disposed over and coupled to the second SMCM. The second SMCM and the superconducting semiconductor structure are electrically coupled to the first SMCM through the interposer. A method of fabricating a cryogenic electronic package is also provided.
Claims19
A cryogenic electronic package, comprising:
- a first superconducting multi-chip module (SMCM) having first and second opposing surfaces;
- a first superconducting interposer having first and second opposing surfaces, wherein the first surface of the first superconducting interposer is disposed over and coupled to the second surface of the first SMCM;
- a second SMCM having first and second opposing surfaces, wherein the first surface of the second SMCM is disposed over and coupled to the second surface of the first superconducting interposer;
- and
- a first superconducting semiconductor structure having first and second opposing surfaces, wherein the first surface of the first superconducting semiconductor structure is disposed over and coupled to the second surface of the second SMCM, and the second SMCM and the first superconducting semiconductor structure are electrically coupled to the first SMCM through the first superconducting interposer.
A method of fabricating a cryogenic electronic package, the method comprising:
- fabricating a first portion of the cryogenic electronic package through a first process, comprising:
- providing a first superconducting multi-chip module (SMCM) having first and second opposing surfaces;
- providing a superconducting interposer having first and second opposing surfaces;
- and
- coupling the first surface of the superconducting interposer to the second surface of the first SMCM;
- fabricating a second portion of the cryogenic electronic package through a second process, comprising:
- providing a second SMCM having first and second opposing surfaces;
- providing a superconducting semiconductor structure having first and second opposing surfaces;
- and
- coupling the first surface of the superconducting semiconductor structure to the second surface of the second SMCM;
- and
- coupling the second portion of the cryogenic electronic package to the first portion of the cryogenic electronic package.
Dependencies are inferred from the claim text.