Thermoelectric module and heat converter including the same

A thermoelectric module, comprising:

• a first substrate including a plurality of first electrodes;
• a second substrate provided opposite the first substrate and including a plurality of second electrodes, the second substrate including a top surface and a bottom surface spaced apart in a first direction, a first side surface and a second side surface spaced apart in a second direction, a first end surface and a second end surface spaced apart in a third direction, wherein the first end surface is between the first side surface and the second side surface, the first end surface is between the top surface and the bottom surface, and the first, second, and third directions are mutually orthogonal;
• a plurality of thermoelectric devices provided between the first substrate and the top surface of the second substrate, the plurality of thermoelectric devices are electrically connected to the plurality of first electrodes and the plurality of second electrodes;
• a first wire connection hole that extends in the first direction from the bottom surface of the second substrate to the top surface of the second substrate to expose a portion of one surface of a first electrode section of the plurality of second electrodes;
• a first guide groove that extends in the second direction from the first wire connection hole to the first side surface of the second substrate;
• a second guide groove that extends in the third direction from the first wire connection hole to the first end surface of the second substrate;
• wherein the first guide groove and the second guide groove are each a structure comprising two opposing lateral sides, a top surface, and an opening opposite the top surface,
• wherein a first portion of the first end surface is provided between the second guide groove and the first side surface, and a second portion of the first end surface is provided between the second guide groove and the second side surface,
• wherein a wire is pulled out through the first wire connection hole, the first guide groove is configured to guide the wire from the first wire connection hole to the first side surface of the second substrate or the second guide groove is configured to guide the wire from the first wire connection hole to the first end surface of the second substrate, and
• wherein a width of the first guide groove is smaller than a diameter of the first wire connection hole.