Light-emitting device and manufacturing method thereof

A light-emitting device, comprising:

• a light-emitting element, comprising a first conductive pad, a second conductive pad, an upper surface, a bottom surface, and a lateral surface arranged between the upper surface and bottom surface;
• a light pervious layer, covering the upper surface and the lateral surface to expose the bottom surface;
• an electrode defining layer, fully arranged under the light pervious layer, and comprising a first recess exposing the first conductive pad, a second recess exposing the second conductive pad and having a different shape from the first recess, and a portion having a curved bottom surface and arranged between the first recess and the second recess;
• a first soldering pad with a melting temperature not greater than 280° C., filled in the first recess in a configuration of directly contacting the first conductive pad and the electrode defining layer residing aside the electrode defining layer, and surrounded by the electrode defining layer;
• and
• a second soldering pad, filled in the second recess, and surrounded by the electrode defining layer,
• wherein the first recess has a first edge, and the second recess has a second edge substantially parallel to the first edge, and the electrode defining layer comprises a first surface and the first soldering pad comprises a second surface, and the first surface is separated from the second surface by a vertical distance of not greater than 10 μm.