Light emitting device including a lead frame and an insulating material
AssigneeLumileds LLC
InventorsShu Li, Thuy Vu
Life of this patent
Estimating the term…
Abstract
Embodiments of the invention include a package for a light emitting diode (LED). The package includes a lead frame, an LED, and an optically reflective but electrically non-conductive molding. The lead frame has a first lead frame part and a second lead frame part electrically isolated from the first lead frame part, each lead frame part having at least one raised pillar. The molding is disposed over the lead frame except over the pillars of the lead frame. The LED is mounted on at least one pillar and is electrically coupled to at least one pillar. The molding serves the purpose of a highly reflective, electrically conductive material like silver without being subject to tarnishing.
Claims14
A light emitting diode (“LED”) package, comprising:
- a first portion of a lead frame, the first portion comprising a single first pillar having a first surface and sidewalls;
- a second portion of the lead frame electrically isolated from the first portion, the second portion comprising a second pillar having a second surface and sidewalls;
- a molding comprising an optically reflective and electrically insulating material on the first portion and the second portion, the molding adjacent to the sidewalls of the first pillar and the sidewalls of the second pillar;
- an LED on the first surface;
- a first wire bond electrically coupling the LED to the first surface;
- and
- a second wire bond electrically coupling the LED to the second surface.
A method of forming a light emitting diode (“LED”) package, the method comprising:
- forming a first portion of a lead frame, the first portion including a single first pillar having a first surface and sidewalls;
- forming a second portion of the lead frame electrically isolated from the first portion, the second portion comprising a second pillar having a second surface and sidewalls;
- forming a molding comprising an optically reflective and electrically insulating material on the first portion and the second portion, the molding adjacent to the sidewalls of the first pillar and the sidewalls of the second pillar;
- forming an LED on the first surface;
- forming a wire bond electrically coupling the LED to the first surface;
- and
- forming a wire bond electrically coupling the LED device to the second surface.
Dependencies are inferred from the claim text.