Semiconductor light emitting element including protective film and light shielding member

A semiconductor light emitting element comprising:

• a support substrate;
• a semiconductor laminated structural body provided on the support substrate, the semiconductor laminated structural body having a first semiconductor layer, a luminescent layer below the first semiconductor layer, and a second semiconductor layer below the luminescent layer;
• a first electrode electrically connected to the first semiconductor layer;
• a second electrode electrically connected to the second semiconductor layer, the second electrode comprising:
• a wiring electrode disposed above a portion of an upper surface of the first electrode,
• a reflecting electrode disposed on a first portion of an upper surface of the wiring electrode, and
• a pad electrode disposed on a second portion of the upper surface of the wiring electrode;
• a first insulating layer disposed on a third portion of the upper surface of the wiring electrode at a location between the reflecting electrode and the pad electrode in a lateral direction;
• a protective film disposed on the semiconductor laminated structural body, wherein the protective film includes a first portion disposed on an upper, light-extraction surface of the semiconductor laminated structural body, and a second portion disposed on lateral surfaces of the semiconductor laminated structural body;
• a light shielding member disposed on the protective film, wherein the light shielding member includes a first portion disposed on a portion of an upper surface of the protective film, and a second portion disposed on lateral surfaces of the protective film, the light shielding member being electrically and physically separated from both of the first electrode and the second electrode by the first insulating layer, and the second portion being on an outer side of the first portion;
• and
• a wavelength conversion member covering at least a portion of the upper surface of the semiconductor laminated structural body that is not covered by the light shielding member,
• wherein the light shielding member has an opening extending through the first portion of the light shielding member, the opening being configured such that light is extractable from the light emitting device via the opening, and
• wherein an entirety of a lower surface of the second semiconductor layer is exposed from the protective film, and an upper surface of the first insulating layer is in direct contact with the second semiconductor layer, the protective film, and the light shielding member.