Package for ultraviolet emitting devices
AssigneeRayVio Corporation
InventorsSaijin Liu, Douglas A. Collins
Life of this patent
Estimating the term…
Abstract
Embodiments of the invention include a light emitting diode (LED) including a semiconductor structure. The semiconductor structure includes an active layer disposed between an n-type region and a p-type region. The active layer emits UV radiation. The LED is disposed on the mount. The mount is disposed on a conductive slug. A support surrounds the conductive slug. The support includes electrically conductive contact pads disposed on a bottom surface, and a thermally conductive pad disposed beneath the conductive slug, wherein the thermally conductive pad is not electrically connected to the LED.
Claims20
A device comprising:
- a light emitting diode (LED) comprising a semiconductor structure comprising an active layer disposed between an n-type region and a p-type region, wherein the active layer emits ultraviolet radiation;
- a mount, wherein the LED is disposed on the mount;
- a support surrounding a conductive slug, the support comprising a thermally conductive pad disposed beneath the conductive slug, wherein the thermally conductive pad is not electrically connected to the LED;
- a lens disposed over the LED;
- a transparent first optical layer disposed directly between the LED and a bottom surface of the lens, and directly contacting the LED and the bottom surface of the lens;
- and
- a transparent adhesive layer directly contacting the LED and laterally encapsulating the LED, the adhesive layer also directly contacting the bottom surface of the lens and affixing the lens to the support, wherein the first optical layer is formed of a first material that is different from a second material forming the adhesive layer, and wherein light from a top surface and side surfaces of the LED is coupled into the bottom surface of the lens via the first optical layer and the adhesive layer;
- wherein the mount is disposed on the conductive slug.
A device comprising:
- a light emitting diode (LED) comprising a semiconductor structure comprising an active layer disposed between an n-type region and a p-type region, wherein the active layer emits ultraviolet radiation;
- a mount, wherein the LED is disposed on the mount;
- a support surrounding a conductive slug, the support comprising an insulating material, electrically conductive contact pads disposed on a bottom surface of the insulating material, and a thermally conductive pad disposed beneath the conductive slug, wherein the thermally conductive pad is not electrically connected to the LED;
- a lens disposed over the LED;
- a transparent first optical layer disposed directly between the LED and a bottom surface of the lens, and directly contacting the LED and the bottom surface of the lens;
- and
- a transparent adhesive layer directly contacting the LED and laterally encapsulating the LED, the adhesive layer also directly contacting the bottom surface of the lens and affixing the lens to the support, wherein the first optical layer is formed of a first material that is different from a second material forming the adhesive layer, and wherein light from a top surface and side surfaces of the LED is coupled into the bottom surface of the lens via the first optical layer and the adhesive layer;
- wherein the mount is disposed on the conductive slug and the insulating material is shaped such that sidewalls facing the LED are slanted and form a reflector cup.
Dependencies are inferred from the claim text.