Optoelectronic component and method for producing an optoelectronic component

A method for producing an optoelectronic component, the method comprising:

• A) providing a semiconductor layer sequence applied to a substrate, the semiconductor layer sequence comprising a top side facing away from the substrate, a first semiconductor layer facing the substrate, a second semiconductor layer facing away from the substrate and an active layer arranged between the first and second semiconductor layer;
• B) applying a mask with at least one opening on the top side of the semiconductor layer sequence;
• C) partial removal of the semiconductor layer sequence in a region of the opening so that a recess is formed in the semiconductor layer sequence, wherein the recess extends from the top side through the entire second semiconductor layer and the active layer and opens into the first semiconductor layer, and wherein, in a region of the first semiconductor layer, the recess has a bottom surface, which is delimited in a lateral direction, parallel to the active layer, by at least one side wall running transversely to the active layer;
• D) depositing a first contact layer directly onto the first semiconductor layer in a region of the bottom surface, wherein a directional process and the same mask as in step C) are used for the deposition;
• E) depositing a mirror layer on an upper side and in the region of the recess, wherein the mirror layer is electrically conductively connected to the second semiconductor layer;
• and
• F) removing the mirror layer in the region above the first contact layer, wherein, when the component is finished, the mirror layer partially covers the recess as seen in plan view of the top side.