Vertical transport fin field effect transistors on a substrate with varying effective gate lengths
AssigneeInternational Business Machines Corporation
InventorsZhenxing Bi, Kangguo Cheng, Juntao Li, Peng Xu
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AssigneeInternational Business Machines Corporation
InventorsZhenxing Bi, Kangguo Cheng, Juntao Li, Peng Xu
Estimating the term…
A method of forming vertical transport fin field effect transistors, including, forming a bottom source/drain layer on a substrate, forming a channel layer on the bottom source/drain layer, forming a recess in the channel layer on a second region of the substrate, wherein the bottom surface of the recess is below the surface of the channel layer on a first region, forming a top source/drain layer on the channel layer, where the top source/drain layer has a greater thickness on the second region of the substrate than on the first region of the substrate, and forming a vertical fin on the first region of the substrate, and a vertical fin on the second region of the substrate, wherein a first top source/drain is formed on the vertical fin on the first region, and a second top source/drain is formed on the vertical fin on the second region.
A plurality of vertical transport fin field effect transistors on a substrate, comprising:
A plurality of vertical transport fin field effect transistors on a substrate, comprising:
A plurality of vertical transport fin field effect transistors on a substrate, comprising:
Dependencies are inferred from the claim text.