Group IIIA-N HEMT with a tunnel diode in the gate stack
AssigneeTexas Instruments Incorporated
InventorsChang Soo Suh, Dong Seup Lee, Jungwoo Joh, Naveen Tipirneni, Sameer Prakash Pendharkar
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AssigneeTexas Instruments Incorporated
InventorsChang Soo Suh, Dong Seup Lee, Jungwoo Joh, Naveen Tipirneni, Sameer Prakash Pendharkar
Estimating the term…
An enhancement-mode High Electron Mobility Transistor (HEMT) includes a substrate, a Group IIIA-N active layer on the substrate, a Group IIIA-N barrier layer on the active layer, and at least one isolation region through the barrier layer to provide an isolated active area having the barrier layer on the active layer. A p-GaN layer is on the barrier layer. A tunnel diode in the gate stack includes an n-GaN layer on an InGaN layer on the p-GaN layer. A gate electrode is over the n-GaN layer. A drain having a drain contact is on the barrier layer to provide contact to the active layer, and a source having a source contact is on the barrier layer provides contact to the active layer. The tunnel diode provides a gate contact to eliminate the need to form a gate contact directly to the p-GaN layer.
A method of forming a transistor, comprising:
A method of forming an electronic device, comprising:
A method of forming an electronic device, comprising:
Dependencies are inferred from the claim text.