Method of manufacturing light emitting device

A method of manufacturing a light emitting device, the method comprising:

• (a) providing a wafer that comprises a supporting substrate and a plurality of light emitting structures, the plurality of light emitting structures being arranged in a two-dimensional array on a first principal surface of the supporting substrate along a first direction and a second direction, each of the plurality of light emitting structures comprising a first semiconductor layer of a first conductivity type, which includes a first region and a second region, and a second semiconductor layer of a second conductivity type, which covers the second region of the first semiconductor layer;
• (b) forming a first insulating layer so as to cover the plurality of light emitting structures, the first insulating layer defining a plurality of first through-holes and a plurality of second through-holes, each of the first through-holes being disposed above the first region of the first semiconductor layer of a respective one of the light emitting structures, each of the second through-holes being disposed above the second semiconductor layer of a respective one of the light emitting structures;
• (c) forming a plurality of first electrically-conductive structures and a plurality of first wirings, each of the plurality of first electrically-conductive structures corresponding to a respective one of the first through-holes and electrically connected with a respective one of the first semiconductor layers, the plurality of first wirings being electrically separated from the plurality of first electrically-conductive structures, each of the plurality of first wirings being electrically connected with the second semiconductor layers of a column of the plurality of light emitting structures that are aligned in the second direction at the second through-holes;
• (d) forming a second insulating layer so as to cover the plurality of first wirings, the second insulating layer defining a plurality of third through-holes, each disposed above a respective one of the plurality of first electrically-conductive structures;
• and
• (e) forming a plurality of second wirings, each of the plurality of second wirings being electrically connected with the first electrically-conductive structures of a row of the plurality of light emitting structures that are aligned in the first direction at the third through-holes.