Method for manufacturing semiconductor apparatus
AssigneesSemiconductor Manufacturing Int'l (Shanghai) Corporation, Semiconductor Manufacturing Intl. (BEIJING) Corp.
InventorsLinbo Shi, Fucheng Chen
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Abstract
The present disclosure relates to the field of semiconductor technologies, and discloses a method for manufacturing a semiconductor apparatus. The method includes: forming a water film on a bottom surface of a top wafer and a top surface of a bottom wafer; after the water film is formed, attaching the bottom surface of the top wafer to the top surface of the bottom wafer; disposing the attached top wafer and bottom wafer in a vacuum environment; and performing a thermal annealing process, so that the bottom surface of the top wafer is fusion-bonded to the top surface of the bottom wafer. The disclosed methods can reduce bubble voids existing between the bonded wafers.
Claims11
A method for manufacturing a semiconductor apparatus, comprising:
- forming a water film on a bottom surface of a top wafer and a top surface of a bottom wafer;
- after the water film is formed, attaching the bottom surface of the top wafer to the top surface of the bottom wafer;
- disposing the attached top wafer and bottom wafer in a vacuum environment;
- and
- performing a thermal annealing process, so that the bottom surface of the top wafer is fusion-bonded to the top surface of the bottom wafer.
Dependencies are inferred from the claim text.