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US 10,381,394 B2Granted
Electronic component and method of manufacturing the same
AssigneeSTMicroelectronics (Crolles 2) SAS
InventorNicolas Hotellier
Life of this patent
Estimating the term…
Abstract
An electronic component includes a semiconductor layer having a first surface coated with a first insulating layer and a second surface coated with an interconnection structure. A laterally insulated conductive pin extends through the semiconductor layer from a portion of conductive layer of the interconnection structure all the way to a contact pad arranged at the level of the first insulating layer.
Claims7
An electronic component, comprising:
- a semiconductor layer having a first surface in contact with a surface of a first insulating layer and having a second surface in contact with a surface of a second insulating layer, said semiconductor layer including integrated circuits at the second surface;
- an insulating portion within the semiconductor layer extending from the first surface to the second surface;
- an opening extending through the second insulating layer and a central portion of the insulating portion in the semiconductor layer which leaves in place an insulating cladding on lateral walls of the opening;
- a conductive pin within the opening that is laterally insulated by the insulating cladding;
- an interconnection structure over the second insulating layer that comprises a conductive layer portion in contact with a first end of the conductive pin;
- a cavity extending only partially through the first insulating layer to a second end of the conductive pin which passes only partially through the first insulating layer;
- and
- a contact pad in the cavity connected to the second end of the conductive pin.
5 more elements
An electronic component, comprising:
- a photosensitive region in a semiconductor substrate layer having a front surface and a back surface;
- a region of insulating material extending from the front surface to the back surface;
- a first insulating layer on the front surface;
- a second insulating layer on the back surface;
- an electrical contact extending through the first insulating layer to make electrical connection to the photosensitive region in the semiconductor substrate layer, said electrical contact made of a first conductive material;
- an opening extending through the first insulating layer and further extending through the region of insulating material to reach at least to said second insulating layer, said opening leaving a portion of the region of insulating material in place at a peripheral sidewall of said opening to insulate the opening from the semiconductor substrate layer;
- a second conductive material completely filling the opening to form an electrical block, wherein the second conductive material is different from the first conductive material;
- a first interconnect over the first insulating layer, said first interconnect comprising a first metal layer having a bottom surface in direct contact with a top surface of the electrical block and a first metal via extending from a top surface of the first metal layer;
- a second interconnect over the first insulating layer, said second interconnect comprising a second metal layer having a bottom surface in direct contact with a top surface of the electrical contact and a second metal via extending from a top surface of the second metal layer;
- an aperture extending through the second insulating layer to reach the electrical block;
- and
- an electrically conducting material filling the aperture to form a connection pad.
9 more elements
Dependencies are inferred from the claim text.