Image pickup apparatus and method for manufacturing image pickup apparatus

A method for manufacturing an image pickup apparatus, the method comprising:

• a wafer step of fabricating a semiconductor wafer to provide, on a light-receiving surface:
• a plurality of light-receiving sections;
• a plurality of electrode pads provided in a row on a periphery of each light-receiving section, the plurality of electrode pads being connected to the light-receiving section;
• a bump on each of the plurality of electrode pads;
• and
• one or more insulating members having a protruding shape between each of the light-receiving sections and each of the plurality of electrode pads, a first height of the one or more insulating members above the light receiving surface being greater than a second height of each corresponding bump above the light receiving surface;
• a cutting step of cutting the semiconductor wafer into individual image pickup devices each including the one or more insulating members and the plurality of electrode pads provided in a row on an outer peripheral portion of the light-receiving section;
• a bonding step of connecting a distal end portion of each of a plurality of inner leads protruding from an end face of a flexible wiring board to a respective one of the plurality of bumps of the image pickup device;
• a first bending step of plastically deforming a bent portion of each of the plurality of inner leads to extend away from the light receiving surface relative to a corresponding distal end portion of each of the plurality of inner leads so as to be inclined relative to the light-receiving surface, the distal end portion of each of the plurality of inner leads being connected to a respective one of the plurality of bumps;
• and
• a second bending step of bending and plastically deforming the plurality of inner leads so that a rear end portion of each of the plurality of inner leads is parallel with a side face of the image pickup device, the rear-end portions of the plurality of inner leads extending from the end face of the flexible wiring board, the end face of the flexible wiring board being smaller in width than a front face of the flexible wiring board;
• wherein:
• in the first bending step, the bent portion of each of the inner leads is bent so as to be in abutment with the one or more insulating members so that a respective one of the rear end portions of the plurality of inner leads is parallel with the side face of the image pickup device.

A method for manufacturing an image pickup apparatus, the method comprising:

• a wafer step of fabricating a semiconductor wafer including, on a light-receiving surface, a plurality of light-receiving sections and a plurality of electrode pads provided in a row on a periphery of each light-receiving section, the plurality of electrode pads being connected to the each light-receiving section;
• a cutting step of cutting the semiconductor wafer into individual image pickup devices each including the plurality of electrode pads provided in a row on an outer peripheral portion of the each light-receiving section;
• a bonding step of connecting distal end portions of a plurality of inner leads protruding from an end face of a flexible wiring board to respective electrode pads of the plurality of electrode pads of the image pickup device;
• a first bending step of plastically deforming the plurality of inner leads so as to be inclined relative to the light-receiving surface, with respective portions of the plurality of inner leads, the respective portions being connected respectively to the plurality of electrode pads, as respective starting points;
• an insertion step of inserting a bending assisting member along a side face of the image pickup device and bringing a distal end of the bending assisting member into abutment with the plurality of inner leads;
• and
• subsequent to the insertion step, a second bending step of bending and plastically deforming the plurality of inner leads so that rear end portions of the plurality of inner leads are parallel with the side face of the image pickup device, the rear-end portions of the plurality of inner leads extending from the end face of the flexible wiring board, the end face of the flexible wiring board being smaller in width than a front face of the flexible wiring board;
• wherein in the second bending step, the plurality of inner leads are bent with respective parts of the plurality of inner leads, the respective parts being in abutment with the bending assisting member, as respective apexes.