Semiconductor memory

A semiconductor memory comprising:

• a first memory chip comprising a plurality of first conductor layers, a first semiconductor material extending in the first conductor layers in a first direction intersecting the first conductor layers, and a charge accumulation layer disposed between at least one of the first conductor layers and the first semiconductor material;
• a circuit chip bonded to the first memory chip, the circuit chip comprising a substrate, and a control circuit on the substrate;
• a joint metal provided in a layer between the first semiconductor material of the first memory chip and the control circuit of the circuit chip, the first semiconductor material and the control circuit being electrically connected via the joint metal;
• and
• an external connection electrode comprising a first portion provided on a surface of the first memory chip, and a second portion extending from a side of the surface of the first memory chip to the circuit chip and electrically connected to the control circuit,
• wherein part of the first conductor layers is disposed between the first portion of the external connection electrode and the substrate.