Method for manufacturing semiconductor device
AssigneeSamsung Electronics Co., Ltd.
InventorsSuk Koo Hong, Miyeong Kang, Hyosung Lee, Kyoungyong Cho, Sunkak Jo
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AssigneeSamsung Electronics Co., Ltd.
InventorsSuk Koo Hong, Miyeong Kang, Hyosung Lee, Kyoungyong Cho, Sunkak Jo
Estimating the term…
Embodiments of the inventive concepts provide a method for manufacturing a semiconductor device. The method includes forming a stack structure including insulating layers and sacrificial layers which are alternately and repeatedly stacked on a substrate. A first photoresist pattern is formed on the stack structure. A first part of the stack structure is etched to form a stepwise structure using the first photoresist pattern as an etch mask. The first photoresist pattern includes a copolymer including a plurality of units represented by at least one of the following chemical formulas 1 to 3, wherein “R1”, “R2”, “R3”, “p”, “q” and “r” are the same as defined in the description.
A method for manufacturing a semiconductor device, the method comprising:
A method for manufacturing a semiconductor device, the method comprising:
A method for manufacturing a semiconductor device, the method comprising:
Dependencies are inferred from the claim text.