Semiconductor device with a layered protection mechanism and associated systems, devices, and methods

A semiconductor device, comprising:

• a first die;
• a second die attached over the first die;
• a first metal enclosure directly contacting and vertically extending between the first die and the second die, wherein the first metal enclosure peripherally encircles a first inner space that includes a set of one or more internal interconnects;
• a second metal enclosure directly contacting and vertically extending between the first die and the second die, wherein:
• the second metal enclosure peripherally encircles the first metal enclosure without directly contacting the first metal enclosure, and
• the second metal enclosure is an outer enclosure that encircles an overall enclosed space, wherein the first inner space is within the overall enclosed space;
• a second inner enclosure directly contacting and vertically extending between the first die and the second die, wherein the second inner enclosure peripherally encircles a further set of interconnects and a second inner space that is within the overall enclosed space and mutually exclusive from the first inner space;
• a first enclosure connector directly contacting the first metal enclosure, wherein the first enclosure connector is for electrically connecting the first metal enclosure to a first voltage level;
• and
• a second enclosure connector directly contacting the second metal enclosure, wherein the second enclosure connector is for electrically connecting the second metal enclosure to a second voltage level;
• wherein the first metal enclosure, the second metal enclosure, the first enclosure connector, and the second enclosure connector are configured to provide an enclosure capacitance.