Structure and method for integrated circuits packaging with increased density

An assembly comprising a plurality of modules, each module of the plurality of modules of the assembly comprising:

• an interposer comprising one or more first vias extending through a substrate of the interposer from a first side of the substrate to a second side of the substrate;
• a first microelectronic element having first contacts coupled to the first side of the substrate for electrical conductivity to at least one of the one or more first vias;
• a second microelectronic element coupled to the second side of the substrate through second contacts, the second contacts coupled to an upper surface of the second microelectronic element for electrical conductivity between at least one of the one or more first vias and at least one or more second vias of the second microelectronic element;
• and
• one or more wire bond wires each having a first end coupled to the upper surface of the second microelectronic element and having a second end opposite the first end corresponding thereto extending past an upper surface of the first microelectronic element, the one or more wire bond wires for electrical conduction or thermal;
• wherein the plurality of modules include a first module and a second module, wherein the second microelectronic element of the second module is attached to the second microelectronic element of the first module.