Guide posts for wire bonding
AssigneeAutomated Assembly Corporation
InventorsKimmo Kyllonen, Robert Neuman
Life of this patent
Estimating the term…
Abstract
A disclosed circuit arrangement includes a support structure having first and second posts. Electrically conductive round wire has a round cross-section, and a first portion is wrapped at least partially around the first post. A second portion of the wire extends in a straight line from a point on a perimeter of the first post to a point on a perimeter of the second post, and a third portion of the wire is wrapped at least partially around the second post. The second portion of the round wire defines one or more bond sites. An electronic device is electrically connected to the round wire at one of the one or more bond sites.
Claims13
A circuit arrangement, comprising:
- a support structure that includes a first post and a second post;
- electrically conductive round wire, the wire having a round cross-section, a first portion wrapped at least partially around the first post, a second portion extending in a straight line from a point on a perimeter of the first post to a point on a perimeter of the second post, and a third portion wrapped at least partially around the second post, wherein the second portion of the round wire defines one or more bond sites;
- and
- an electronic device electrically connected to the round wire at one of the one or more bond sites.
Dependencies are inferred from the claim text.