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US 10,381,323 B2Granted
Metal bonding pads for packaging applications
AssigneeInternational Business Machines Corporation
InventorChih-Chao Yang
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Abstract
Methods and semiconductor devices for bonding a first semiconductor device to a second semiconductor device include forming metal pads including a textured microstructure having a columnar grain structure at substantially the same angular direction from the top surface to the bottom surface. The textured crystalline microstructures enables the use of low temperatures and low pressures to effect bonding of the metal pads. Also described are methods of packaging and semiconductor devices.
Claims14
A method for bonding a first semiconductor device to a second semiconductor device, comprising:
- providing a first semiconductor device comprising a first metal pad, wherein the first metal pad has a textured microstructure having a columnar grain structure at substantially the same angular direction from the top surface to the bottom surface;
- providing a second semiconductor device comprising a second metal pad, wherein the second metal pad has a textured microstructure having a columnar grain structure at substantially the same angular direction from the top surface to the bottom surface;
- contacting the second metal pad to the first metal pad;
- and
- bonding the first semiconductor device to the second semiconductor device at a temperature of less than 250° C. to greater than 100° C. and at a pressure of less than 250 psi to greater than 50 psi.
2 more elements
Dependencies are inferred from the claim text.