Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the same
AssigneeKulicke and Soffa Industries, Inc.
InventorDominick A. DeAngelis
Life of this patent
Estimating the term…
Abstract
An ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange.
Claims19
An ultrasonic transducer system comprising:
- a transducer mounting structure;
- a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure;
- and
- a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange,
- wherein the tuned resonator is configured to move a resonant frequency of the transducer mounting structure away from an operating frequency of the transducer.
A wire bonding machine comprising:
- a support structure for supporting a workpiece configured to receive wire bonds during a wire bonding operation;
- a wire bonding tool configured to form the wire bonds on the workpiece;
- and
- an ultrasonic transducer system for carrying the wire bonding tool, the ultrasonic transducer system including (a) a transducer mounting structure, (b) a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure, and (c) a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange,
- wherein the tuned resonator is configured to move a resonant frequency of the transducer mounting structure away from an operating frequency of the transducer.
A flip chip bonding machine comprising:
- a support structure for supporting a workpiece configured to receive a semiconductor element during a flip chip bonding operation;
- a bonding tool configured to bond the semiconductor element to the substrate;
- and
- an ultrasonic transducer system for carrying the bonding tool, the ultrasonic transducer system including (a) a transducer mounting structure, (b) a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure, and (c) a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange,
- wherein the tuned resonator is configured to move a resonant frequency of the transducer mounting structure away from an operating frequency of the transducer.
A method of providing an ultrasonic transducer system, the method comprising the steps of:
- (a) providing a transducer and a transducer mounting structure;
- (b) coupling the transducer to the transducer mounting structure using at least one mounting flange of the transducer;
- and
- (c) integrating a tuned resonator having a desired resonant frequency with at least one of the transducer mounting structure and the at least one mounting flange,
- wherein step (c) includes integrating the tuned resonator to move a resonant frequency of the transducer mounting structure away from an operating frequency of the transducer.
Dependencies are inferred from the claim text.