Semiconductor package device and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChia-Liang Chung, Pei-Ling Li
Life of this patent
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Abstract
The disclosure relates to a semiconductor package device. The semiconductor package device includes a substrate having a first surface and a second surface opposite to the first surface and including a first conductive contact. The semiconductor package device further includes an electronic component disposed on the first surface of the substrate. The semiconductor package device further includes a metal frame disposed on the first surface of the substrate. The semiconductor package device further includes an antenna disposed on the metal frame, wherein the antenna is electrically isolated from the metal frame and electrically connected to the first conductive contact of the substrate.
Claims19
A semiconductor package device, comprising:
- a substrate having a first surface, a second surface opposite to the first surface, and a lateral surface, and comprising a first conductive contact;
- an electronic component disposed on the first surface of the substrate;
- a metal frame disposed on the first surface of the substrate;
- and
- an antenna disposed on the metal frame, wherein the antenna is electrically isolated from the metal frame and electrically connected to the first conductive contact of the substrate, and the antenna has an outer lateral surface substantially coplanar with the lateral surface of the substrate.
A method of manufacturing a semiconductor package device, comprising:
- providing a substrate including a first surface, a second surface opposite to the first surface, and a lateral surface;
- disposing an electronic component on the first surface of the substrate;
- and
- attaching a metal frame, on which an antenna is disposed and from which the antenna is electrically isolated, on the first surface of the substrate through a first conductive contact so that the antenna is electrically connected to the substrate through the first conductive contact, wherein the antenna has an outer lateral surface substantially coplanar with the lateral surface of the substrate.
Dependencies are inferred from the claim text.