Method of manufacturing mounting member and method of manufacturing electronic component

A method of manufacturing a mounting member including a base member having an arrangement region for an electronic device, and a frame member having an opening corresponding to the arrangement region and adhered to a periphery of the arrangement region of the base member, comprising:

• placing a base member and a frame member having a thermal expansion coefficient different from a thermal expansion coefficient of the base member in a state in which the base member is stacked with the frame member and a thermosetting adhesive agent is interposed between the base member and the frame member;
• adhering the base member and the frame member by heating the base member, the frame member, and the adhesive agent from the state to a temperature equal to or higher than a curing temperature of the adhesive agent;
• and
• cooling the base member and the frame member from the curing temperature, wherein the frame member has a quadrilateral shape including:
• a first side including a first corner, a second corner and a first intermediate portion between the first corner and the second corner,
• a second side including a third corner, a fourth corner, and a second intermediate portion between the third corner and the fourth corner,
• a third side including the first corner, the third corner, and a third intermediate portion between the first corner and the third corner, and
• a fourth side including the second corner, the fourth corner, and a fourth intermediate portion between the second corner and the fourth corner, and
• in the state, the first side is warped so that a distance between the first intermediate portion and the base member is larger than a distance between the first corner and the base member and a distance between the second corner and the base member, and
• in the state, the second side is warped so that a distance between the second intermediate portion and the base member is larger than a distance between the third corner and the base member and a distance between the fourth corner and the base member, and
• in the cooling, a deformation in which warpage of the first side is reduced occurs in the first side, and a deformation in which the warpage of the second side is reduced occurs in the second side.