Semiconductor device and method of manufacturing a semiconductor device

A method of manufacturing an electronic device, the method comprising:

• receiving an assembly comprising:
• a first redistribution structure (RDS);
• a first semiconductor die coupled to the first RDS;
• a first interconnection structure coupled to the first RDS;
• a second redistribution structure (RDS);
• a second semiconductor die coupled to the second RDS;
• and
• a second interconnection structure coupled to the second RDS;
• coupling a first end of a conductive strap to the first RDS and a second end of the conductive strap to the second RDS;
• forming an encapsulant that laterally surrounds at least the first RDS, the first semiconductor die, the first interconnection structure, the second RDS, the second semiconductor die, and the second interconnection structure;
• and
• cutting the encapsulant and the strap to separate a first part of the encapsulant, a first part of the strap, the first RDS, the first semiconductor die, and the first interconnection structure from a second part of the encapsulant, a second part of the strap, the second RDS, the second semiconductor die, and the second interconnection structure.

A method of manufacturing an electronic device, the method comprising:

• receiving an assembly comprising:
• a redistribution structure (RDS);
• a semiconductor die coupled to the RDS;
• an interconnection structure coupled to the RDS;
• a conductive strap comprising a first end coupled to the RDS, and a second end;
• and
• forming an encapsulant that at least laterally surrounds at least the RDS, the interconnection structure, the semiconductor die, and the conductive strap, wherein a first surface of the encapsulant is generally coplanar with a second end of the conductive strap.