Embedded multi-die interconnect bridge
AssigneeIntel Corporation
InventorArvind Sundaram
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to devices and techniques for an interconnect bridge to communicatively couple two or more dies. In an example, the interconnect bridge can include a base element having a first material. A first layer, including a second material, can be attached to the base element. A second layer, including a third material, can be disposed on the first layer. A two-dimensional electron gas (2DEG) can be located between the first layer and the second layer. A first contact, adapted to electrically couple to the first die, can be disposed in a first side of the 2DEG. A second contact, adapted to electrically couple to the second die, can be disposed in a second side of the 2DEG. Accordingly, the first die can be electrically coupled to the second die through the 2DEG.
Claims25
An interconnect bridge for communicatively coupling two or more dies of an electronic package, the interconnect bridge comprising:
- a base element including a first material, wherein the base element is attachable to a substrate configured to support a first die and a second die;
- a first layer attached to the base element, wherein the first layer includes a second material;
- a second layer disposed on the first layer, wherein the second layer includes a third material;
- a two-dimensional electron gas (2DEG) located between the first layer and the second layer;
- a first contact disposed on the first layer, extending through the second layer, and in the 2DEG, the first contact adapted to electrically couple to the first die;
- and
- a second contact disposed on the first layer, extending through the second laver, and in the 2DEG at a distance from the first contact, the second contact adapted to electrically couple to the second die, wherein the first contact is electrically coupled to the second contact through the 2DEG.
A method of communicatively coupling a first die to a second die with an interconnect bridge, the method comprising:
- disposing a first layer on a base element, wherein the base element is a first material and the first layer is a second material different from the first material;
- disposing a second layer on the first layer, wherein the second layer includes a third material different from the second material, and a lattice parameter of the second material is different from a lattice parameter of the third material to form a two-dimensional electron gas (2DEG) between the first layer and the second layer;
- forming a first contact on the first layer extending through the second layer, and in the 2DEG, the first contact adapted to be electrically coupled to a first die;
- and
- forming a second contact on the first layer, extending through the second layer, and in the 2DEG, the second contact adapted to be electrically coupled to a second die.
An electronic package including an interconnect bridge for communication between a first die and a second die of the electronic package, the electronic package comprising:
- a first die and a second die attached to a substrate;
- and
- an interconnect bridge electrically coupling the first die to the second die, the interconnect bridge including:
- a base element including a first material, wherein the base element s attachable to the substrate,
- a first layer attached to the base element, wherein the first layer includes a second material,
- a second layer disposed on the first layer, wherein the second layer includes a third material,
- a two-dimensional electron gas (2DEG) located between the first layer and the second layer,
- a first contact disposed on the first laver, extending through the second layer, and in the 2DEG, the first contact adapted to electrically couple to the first die, and
- a second contact disposed on the first layer, extending through the second layer, and in the 2DEG, the second contact adapted to electrically couple to the second die, wherein the first contact is located at a distance from the second contact.
Dependencies are inferred from the claim text.