US 10,381,305 B2Granted

Integrated assemblies having structures along a first pitch coupled with structures along a second pitch different from the first pitch, and methods of forming integrated assemblies

AssigneeMicron Technology, Inc.

InventorWerner Juengling

Life of this patent

Estimating the term…

Loading patent…

Abstract

Some embodiments include a method of forming an integrated assembly. Conductive lines are formed to extend along a first direction, and are spaced from one another by a first pitch. Protective knobs are formed over the conductive lines and are arranged in rows. The protective knobs within each row are spaced along a second pitch which is greater than the first pitch. The protective knobs protect regions of the conductive lines while leaving other regions of the conductive lines unprotected. The unprotected regions are recessed so that the protected regions become tall regions and the unprotected regions become short regions. The protective knobs are removed. Conductive structures are formed over the conductive lines. The conductive structures are spaced along the second pitch. Each of the conductive lines is uniquely coupled to only one of the conductive structures. Some embodiments include integrated assemblies.

Claims23

Dependent claims

An integrated assembly, comprising:

first conductive structures spaced along a first pitch along a cross-section;
the first conductive structures having a first width along the cross-section;
second conductive structures over the first conductive structures and spaced along a second pitch along the cross-section, the second pitch being at least about two-times greater than the first pitch;
the second conductive structures having a second width along the cross-section which is greater than the first width;
each of the second conductive structures being directly over more than one of the first conductive structures along the cross-section;
each of the second conductive structures being coupled with only one of the first conductive structures directly under the second conductive structures along the cross-section;
the first conductive structures which are coupled with the second conductive structures along the cross-section having first uppermost surfaces;
some of the first conductive structures being directly under the second conductive structures and not being coupled to the second conductive structures;
said some of the first conductive structures having second uppermost surfaces below the first uppermost surfaces;
and
wherein the first conductive structures extend through an insulative support material;
and wherein a second insulative material is over the insulative support material and over the second uppermost surfaces.

9 more elements

A method of forming an integrated assembly, comprising:

forming first conductive structures within an insulative support material, the first conductive structures being a row of regularly spaced features along a cross-section, with the regularly spaced features being spaced along a first pitch along the cross-section;
forming protective material over some of the first conductive structures while leaving others of the first conductive structures uncovered by the protective material;
the first conductive structures having the protective material formed thereover being protected first conductive structures and the remaining first conductive structures being unprotected first conductive structures;
the protected first conductive structures being provided at regular intervals and being along a second pitch along the cross-section, with the second pitch being at least about two-times greater than the first pitch;
recessing the unprotected first conductive structures relative to the protected first conductive structures;
after the recessing, the protected first conductive structures being tall first conductive structures having first upper surfaces and the unprotected first conductive structures being short first conductive structures having second upper surfaces, with the first upper surfaces being at least about 100 Å above the second upper surfaces;
removing the protective material;
and
forming second conductive structures over the first conductive structures;
the second conductive structures being spaced along the second pitch along the cross-section;
the second conductive structures being electrically coupled to the tall first conductive structures and not being electrically coupled to the short first conductive structures;
at least some of the short first conductive structures being directly under the second conductive structures along the cross-section and being spaced from the second conductive structures by one or more intervening insulative materials.

9 more elements

A method of forming an integrated assembly, comprising:

forming conductive lines within an insulative support material, the conductive lines extending along a first direction, and being spaced from one another by a first pitch along a second direction, with the second direction being substantially orthogonal to the first direction;
forming protective material knobs over the conductive lines;
the protective material knobs being arranged in rows, the rows extending along the second direction;
the protective material knobs within each row being spaced along a second pitch along the second direction;
the second pitch being at least about two-times greater than the first pitch;
adjacent rows being offset relative to one another along the second direction by an increment corresponding to the first pitch;
the protective material knobs protecting regions of the conductive lines while leaving other regions of the conductive lines unprotected;
recessing the unprotected regions of the conductive lines relative to the protected regions of the conductive lines;
after the recessing, the protected regions of the conductive lines being tall regions having first upper surfaces and the unprotected regions of the conductive lines being short regions having second upper surfaces below the first upper surfaces;
removing the protective material knobs;
and
forming conductive structures over the conductive lines;
the conductive structures being spaced along the second pitch along the second direction;
the conductive structures being electrically coupled to the tall regions of the conductive lines;
each of the conductive lines being uniquely coupled to only one of the conductive structures relative to all others of the conductive lines.

12 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/690,209Filed 29 Aug 2017
Published: US 2019/0067193 A128 Feb 2019
Granted: 13 Aug 2019
Term ends: Not estimatedThe source records don’t support an estimate.

Classification13 codes

H10W 20/435
Characterised by their conductive parts: cross-sectional shapes or dispositions of interconnections
H10B 69/00
Erasable-and-programmable rom [eprom] devices not provided for in groups h10b41/00 - h10b63/00
H10W 20/038
Of conductive barrier, adhesion or liner layers: covering conductive structures
H10W 20/056
Of conductive parts of the interconnections: by filling conductive material into holes, grooves or trenches