Interconnect structure
AssigneeGlobalfoundries Inc.
InventorsLuke England, Mark W. Kuemerle
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to semiconductor structures and, more particularly, to an interconnect structure to connect between different package configurations and methods of manufacture. The structure includes an interconnect comprising a plurality of conductive levels and columns configured into a grid pattern within an insulator material, the plurality of conductive levels and columns aligned to connect to different package configurations; and a control circuit that provides a signal to the interconnect to connect to a combination of the different package configurations.
Claims20
A structure, comprising:
- an interconnect comprising a plurality of conductive levels and columns configured into a grid pattern within an insulator material, the plurality of conductive levels and columns aligned to connect to different package configurations with different connection technologies;
- and
- a control circuit which includes programmable fuses associated with the different package configurations with the different connection technologies and which is configured to provide a control signal to the interconnect to connect the interconnect to any combination of the different package configurations with the different connection technologies.
An interconnect structure comprising:
- a back end of the line interconnect comprising a conductive grid pattern comprising a plurality of columns configured to connect to different package configurations with different connection technologies;
- and
- a control circuit with programmable fuses associated with the different package configurations with the different connection technologies and which, upon being blown, connect the back end of the line interconnect to any combination of the different package configurations with the different connection technologies.
A process comprising:
- fabricating a control circuit and interconnect structure comprising a conductive grid pattern comprising a plurality of columns configured to connect to different package configurations with different connection technologies;
- determining which type(s) of package configuration will be used in a module assembly;
- and
- blowing an appropriate fuse(s) of the control circuit for an intended package type used in the module assembly such that the interconnect structure makes an electrical connection to the intended package type.
Dependencies are inferred from the claim text.