Semiconductor package and method for fabricating the same

A method for fabricating a semiconductor package comprising:

• providing a workpiece, wherein the workpiece comprising a first redistribution layer, conductive vias and a first wafer, the conductive vias are extended into the first wafer, the first redistribution layer being disposed on the first wafer, connected to the conductive vias, and comprising first discrete conductive routes formed therein;
• disposing a first semiconductor device on a side of the first redistribution layer away from the conductive vias;
• disposing a second semiconductor device on the side of the first redistribution layer away from the conductive vias, the first discrete conductive routes extending between and connecting the first semiconductor device to the second semiconductor device, the first and second semiconductor devices being connected to the first redistribution layer;
• forming a first molding compound to surround the first and second semiconductor devices such that at least a portion of the first molding compound is disposed between the first semiconductor device and the first redistribution layer and abuts against the first redistribution layer;
• removing the first wafer;
• forming a second molding compound to surround the first redistribution layer and at least part of the first molding compound, wherein the conductive vias are exposed on a surface of the second molding compound away from the first redistribution layer;
• and
• forming a second redistribution layer on a surface of the second molding compound away from the first redistribution layer and electrically connected to the first redistribution layer through the conductive vias.