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US 10,381,295 B2Granted
Lead frame having redistribution layer
AssigneeNXP USA, Inc.
InventorsMichael Vincent, Ryan Hooper, Dwight Daniels
Life of this patent
Estimating the term…
Abstract
Embodiments of a packaged semiconductor device are provided, which includes a flag of a lead frame having a top surface and a bottom surface; a redistribution layer (RDL) structure formed on the top surface of the flag, the RDL structure including a first connection path having a first exposed bonding surface in a top surface of the RDL structure; and a first wirebond connected to the first exposed bonding surface and to a lead of the lead frame.
Claims20
A packaged semiconductor device comprising:
- a flag of a lead frame having a top surface and a bottom surface;
- a redistribution layer (RDL) structure formed on the top surface of the flag, the RDL structure comprising a first connection path having a first exposed bonding surface in a top surface of the RDL structure;
- and
- a first wirebond connected to the first exposed bonding surface and to a lead of the lead frame.
1 more element
A packaged semiconductor device comprising:
- a flag of a lead frame having a top surface and a bottom surface;
- a redistribution layer (RDL) structure formed on the top surface of the flag, the RDL structure comprising a plurality of connection paths;
- an opening through the bottom surface of the flag to a bottom surface of the RDL structure, wherein one or more bonding surfaces of the plurality of connection paths are exposed in the bottom surface of the RDL structure within the opening;
- and
- an electronic component having a plurality of solder bumps, wherein each of the plurality of solder bumps are connected to a respective bonding surface of the RDL structure exposed within the opening.
2 more elements
Dependencies are inferred from the claim text.