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US 10,381,293 B2Granted
Integrated circuit package having an IC die between top and bottom leadframes
AssigneeTexas Instruments Incorporated
InventorsLee Han Meng@Eugene Lee, Chong Han Lim, You Chye How
Life of this patent
Estimating the term…
Abstract
An integrated circuit (IC) package includes a first leadframe having a top surface and a bottom surface. An IC die has an active side coupled to the first leadframe bottom surface and has a back side. A second leadframe has a top surface and a bottom surface. The back side of said IC chip is coupled to the top surface of the second leadframe.
Claims19
An integrated circuit (IC) package comprising
- a first leadframe having a top surface and a bottom surface, said top surface of said first leadframe is covered by mold compound, said mold compound does not extend past said bottom surface of said first leadframe;
- an IC die having an active side coupled to said first leadframe bottom surface and having a back side;
- and
- a second leadframe having a top surface and a bottom surface, said back side of said IC die coupled to said top surface of said second leadframe.
1 more element
A method of making an integrated circuit (“IC”) package comprising:
- providing a leadframe strip having a plurality of leadframes including a first leadframe having inner lead portions and peripheral lead portions;
- mounting at least one passive device on the first leadframe;
- encapsulating the first leadframe strip including the at least one passive device and portions of the first leadframe in mold compound with at least portions of the first leadframe interior lead portions and at least portions of the first leadframe peripheral lead portions exposed, the mold compound does not extend past the interior lead portions of the first leadframe;
- and
- coupling an active side of an IC die to the interior lead portions of the first leadframe to form a first die-mounted encapsulated leadframe assembly.
2 more elements
A method of making an integrated circuit (“IC”) package comprising:
- encapsulating a first leadframe and passive devices mounted thereon;
- coupling an active surface of an IC die to exposed portions of the encapsulated first leadframe;
- and
- sandwiching the IC die between the first leadframe and a second leadframe.
1 more element
Dependencies are inferred from the claim text.