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US 10,381,290 B2Granted
Method of manufacturing an electronic device
AssigneeFujitsu Limited
InventorsShinichi Hirose, Daiyu Kondo
Life of this patent
Estimating the term…
Abstract
A method of manufacturing an electronic device includes: placing a resin film on a component; and while heating the resin film to be softened, pressing end portions of a plurality of carbon nanotubes against the softened resin film to bring the end portions into contact with the component, and causing the softened resin film to climb up side surfaces of the carbon nanotubes.
Claims6
A method of manufacturing an electronic device, the method comprising:
- placing a resin film with a first thickness on a component;
- and
- while heating the resin film to be softened, pressing end portions of a plurality of carbon nanotubes against the softened resin film to bring the end portions into contact with the component, and causing the softened resin film to climb up side surfaces of the carbon nanotubes so that a first portion of each of the carbon nanotubes is covered with the resin film, and the first portion has a first length,
- wherein the first length is greater than the first thickness, and intermediate portions of the carbon nanotubes other than the first portions are uncovered with and exposed from the resin film.
1 more element
Dependencies are inferred from the claim text.