Heat sink interface for a device
AssigneeMentor Graphics Corporation
InventorsSpencer Saunders, Terry Goode
Life of this patent
Estimating the term…
Abstract
This application discloses an device disposed on a substrate, and a heat sink disposed on the substrate over the device. The heat sink disposed on the substrate forms a cavity to hold a fluid between the heat sink and the device. The fluid can absorb heat emitted by the device and transfer at least a portion of the absorbed heat to the heat sink. A gasket can be disposed between and in contact with the substrate and the heat sink. The gasket can prevent the fluid from exiting the cavity formed by the heat sink disposed on the substrate. The heat sink can have an opening to the cavity, which can be detachably sealed by a plug. The plug can reduce a pressure within the cavity or allow removal of gas bubbles in the fluid held in the cavity.
Claims13
A system comprising:
- a device disposed on a substrate;
- a heat sink disposed on the substrate over the device to form a cavity, wherein the heat sink includes a first opening to allow a fluid to enter the cavity, wherein the cavity is configured to hold the fluid between the heat sink and the device, the fluid to absorb heat emitted by the device and transfer at least a portion of the absorbed heat to the heat sink;
- a relief plug disposed in the first opening formed in the heat sink, wherein the relief plug includes a conduit configured to allow the fluid to enter the cavity through the first opening in the heat sink;
- and
- a bleed plug disposed in a second opening formed in the heat sink, wherein the bleed plug is configured to allow removal of gas from the cavity through the bleed plug and the second opening in the heat sink.
A method comprising:
- mounting a heat sink on a substrate disposed over a device to form a cavity between the heat sink and the device, wherein the heat sink includes a first opening to allow a fluid to enter the cavity between the heat sink and the device;
- disposing a relief plug in the first opening formed in the heat sink, wherein the relief plug includes a conduit configured to allow the fluid to enter the cavity through the first opening in the heat sink;
- disposing a bleed plug in a second opening formed in the heat sink, wherein the bleed plug is configured to allow removal of gas from the cavity through the bleed plug and the second opening in the heat sink;
- and
- filling, through the relief plug and the first opening formed in the heat sink, the cavity between the heat sink and the device with the fluid configured to absorb heat emitted by the device and transfer at least a portion of the absorbed heat to the heat sink.
Dependencies are inferred from the claim text.