US 10,381,286 B2Granted

Power module

AssigneeDelta Electronics (Shanghai) Co., Ltd.

InventorsShou-Yu Hong, Gan-Yu Zhou, Jian-Hong Zeng, Zhen-Qing Zhao

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Abstract

A power module is disclosed. The power module includes a first substrate, a first metal layer, at least one conductive structure and at least one power device. The first metal layer is disposed on the first substrate. The first metal layer has a first thickness d1. The first thickness d1 satisfies: 5 μm≤d1≤50 μm. The conductive structure is disposed at a position different to the first metal layer on the first substrate. The conductive structure has a second thickness d2. The second thickness d2 satisfies: d2≥100 μm. The power device is disposed on the first substrate, the first metal layer or the conductive structure. The driving electrode of the power device is electrically connected to the first metal layer. The power electrode of the power device is electrically coupled to the conductive structure.

Claims12

Dependent claims

A power module, comprising:

a first substrate;
a first metal layer disposed on the first substrate;
a plurality of conductive structures disposed on the first substrate, wherein the conductive structures are thicker than the first metal layer;
a first power device disposed on one of the conductive structures, wherein a first power electrode of the first power device is electrically coupled to said one of the conductive structures;
and
at least one controlling component or a driving component, disposed on the first metal layer over the first substrate, wherein the first metal layer is thinner than the conductive structures over the first substrate, wherein a driving electrode of the first power device is electrically coupled to an electrode of the controlling component or the driving component
a second power device disposed on the first substrate, wherein a second power electrode of the first power device is wired to the second power device, wherein the second power device is disposed on another of the conductive structures.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/671,132Filed 7 Aug 2017 · continuation
Priority: CN 2013 1 043546623 Sep 2013
Published: US 2017/0358516 A114 Dec 2017
Granted: 13 Aug 2019
Term ends: Not estimatedThe source records don’t support an estimate.

Classification18 codes

H10W 40/255
Characterised by their materials: having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
H10W 40/10
Arrangements for thermal protection or thermal control: arrangements for heating
H10W 40/778
Auxiliary members characterised by their shape: in encapsulations
H10W 70/442
Shapes or dispositions: of multiple leadframes in a single chip