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US 10,381,284 B2Granted
Semiconductor package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorMi Suk Choi
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a first electronic component disposed on a first surface of a substrate, a first conductive member disposed on the first electronic component, and a sealing member configured to cover the first electronic component and forming a hole to expose the first conductive member to an exterior of the semiconductor package. The semiconductor package also includes a second conductive member disposed on the hole and connected to the first conductive member.
Claims16
A semiconductor package, comprising:
- a first electronic component disposed on a first surface of a substrate;
- a first conductive member disposed on the first electronic component;
- a sealing member configured to cover the first electronic component and comprising a hole to expose the first conductive member to an exterior of the semiconductor package;
- and
- a second conductive member disposed on the hole and connected to the first conductive member;
- wherein the second conductive member comprises a second seed layer and a second metal layer.
3 more elements
A semiconductor package, comprising:
- a first electronic component disposed on a first surface of a substrate;
- a first conductive member disposed on the first electronic component;
- a sealing member formed on the first surface of the substrate and on the first electronic component, wherein a cavity extends through the sealing member to expose a portion of the first conductive member;
- a second conductive member disposed on an inner surface of the cavity;
- and
- an oxidation prevention layer configured to cover the second conductive member and the portion of the first conductive member;
- wherein the second conductive member comprises a second seed layer and a second metal layer.
4 more elements
Dependencies are inferred from the claim text.