Tetramethylbiphenol type epoxy resin, epoxy resin composition, cured product, and semiconductor sealing material
AssigneeMitsubishi Chemical Corporation
InventorKazumasa Oota
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Abstract
The present invention relates to a tetramethylbiphenol type epoxy resin having a content of a sodium ion of 1 to 12 ppm which is determined by measurement by the atomic absorption spectrometry using a solution wherein a sample is dissolved in N-methylpyrrolidone.
Claims6
An epoxy resin composition comprising a tetramethylbiphenol type epoxy resin, a phosphorus-based curing accelerator, and a curing agent and the tetramethylbiphenol epoxy resin having a content of a sodium ion of 2 to 12 ppm and the epoxy resin composition having a content of a sodium ion of 1.2 to 7.6 ppm which is determined by the following measurement method, and wherein a content of the phosphorus-based curing accelerator is 73 or more and 439 or less in a P/Na molar ratio, which is calculated as a phosphorus atom, to a sodium ion which is in the epoxy resin composition and determined by the following measurement method:
- (Measurement Method) Measurement by the atomic absorption spectrometry using a solution wherein a sample is dissolved in N-methylpyrrolidone.
Dependencies are inferred from the claim text.