Electronic component housing package, multi-piece wiring substrate, electronic apparatus, and electronic module having curved connection conductors

An electronic component housing package, comprising:

• an insulating substrate having a first principal face and a second principal face opposing the first principal face, the insulating substrate having a lower insulating layer including the second principal face, the lower insulating layer having a mounting section for mounting an electronic component, and a frame-shaped upper insulating layer including the first principal face, the frame-shaped upper insulating layer being provided on the lower insulating layer so as to surround the mounting section;
• a plurality of external connection conductors provided on the second principal face;
• and
• a plurality of curved connection conductors each extending from an outer peripheral end of corresponding external connection conductor to an outer peripheral end of the insulating substrate,
• each of the curved connection conductors being provided so as to be curved convexly toward a first principal face side over a range from the outer peripheral ends of the external connection conductors to the outer peripheral ends of the insulating substrate in a vertical cross-sectional view of the electronic component housing package and so that a distance from a lower side of each of the curved connection conductors to the second principal face continuously increases for most of a length from the outer peripheral end of the corresponding external connection conductor to the outer peripheral end of the insulating substrate,
• insulating bodies being provided so as to cover the connection conductors, respectively.