Testing method of packaging process and packaging structure
AssigneePowertech Technology Inc.
InventorsHung-Hsin Hsu, Shang-Yu Chang Chien, Nan-Chun Lin
Life of this patent
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Abstract
A testing method of a packaging process includes following steps. A substrate is provided. A circuit structure is formed on the substrate. The circuit structure includes a real unit area and a dummy side rail surrounding the real unit area, and a plurality of first circuit patterns is disposed on the real unit area. A second circuit pattern is formed on the dummy side rail, and the second circuit pattern emulates the configurations of at least a portion of the first circuit patterns for operating a simulation test. In addition, a packaging structure adapted for a testing process is also mentioned.
Claims10
A testing method of a packaging process comprising:
- providing a substrate;
- forming a circuit structure on the substrate, wherein the circuit structure comprises a real unit area and a dummy side rail surrounding the real unit area, and a plurality of first circuit patterns is disposed on the real unit area;
- and
- forming a second circuit pattern on the dummy side rail, wherein the second circuit pattern emulates configurations of at least a portion of the first circuit patterns for operating a simulation test and is electrically isolated from the first circuit patterns.
Dependencies are inferred from the claim text.