Process for producing connections to an electronic chip
AssigneeCommissariat A L'energie Atomique Et Aux Energies Alternatives
InventorsNicolas Posseme, Yann Mazel
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Abstract
A process for producing conductive connections to an electronic chip, comprising the following steps: a) depositing an insulating layer on one face of a wafer; b) producing a layer based on at least one metal covering the insulating layer and equipped with first apertures; c) etching second apertures in the insulating layer in the extension of the first apertures by plasma etching in a plasma based on at least one halogen-containing compound; d) vacuum annealing the entire structure obtained after step c); and e) forming, after step d), the conductive connections in the second apertures.
Claims12
A method of forming conductive connections of an electronic chip, comprising the successive steps of:
- a) depositing an insulating layer on a surface of a wafer;
- b) forming a layer made up of at least one metal covering the insulating layer and provided with first openings;
- c) etching second openings in the insulating layer in line with the first openings by etching with a plasma made up of at least one halogenated compound;
- d) exposing the assembly formed by structure obtained after step c) to oxygen, to a mixture of hydrogen and nitrogen, or to a mixture of methane and nitrogen;
- e) annealing said assembly in vacuum;
- and
- f) forming, after step e), the conductive connections in the second openings.
Dependencies are inferred from the claim text.