Double layer release temporary bond and debond processes and systems

A method, comprising:

• providing a bonded structure that comprises a first substrate containing at least one feature, the first substrate having a top surface and an opposed bottom surface;
• an adhesive layer overlying the top surface of the first substrate;
• a curable polyimide release layer overlying the adhesive layer;
• the curable polyimide release layer, the adhesive layer, and the first substrate being absorptive of a first beam of light having a predetermined wavelength;
• and a second substrate having a bottom surface and an opposed top surface, the bottom surface overlying the release layer, the second substrate being substantially transparent to the first beam of light having the predetermined wavelength;
• applying the first beam of light having the predetermined wavelength to the bonded structure to scribe the curable polyimide release layer, the adhesive layer, and the first substrate;
• and
• applying a second beam of light of a predetermined wavelength to the bonded structure, the second substrate being substantially transparent to the second beam of light of the predetermined wavelength, to at least one of decompose, ablate, and vaporize the curable polyimide release layer to debond the curable polyimide release layer from the second substrate, thereby separating at least two sub-structures from the second substrate.