Auto-correction of electrostatic chuck temperature non-uniformity

A system for controlling a temperature of a wafer processing substrate, wherein the wafer processing substrate includes at least one first thermal control element arranged within the wafer processing substrate and a plurality of second thermal control elements arranged throughout the wafer processing substrate, the system comprising:

• memory that stores first temperature responses of the at least one first thermal control element, wherein the first temperature responses correspond to temperature responses as observed in the at least one first thermal control element in response to a first control parameter of the at least one first thermal control element being maintained at a predetermined first value, wherein the first control parameter corresponds to an input for adjusting the at least one first thermal control element;
• a first controller configured to receive a setpoint temperature for the wafer processing substrate and maintain the first control parameter of the at least one first thermal control element at a second value different from the predetermined first value based on the received setpoint temperature;
• and
• a second controller configured to
• retrieve the first temperature responses from the memory,
• calculate temperature non-uniformities associated with the wafer processing substrate at the second value using (i) the first temperature responses corresponding to the temperature responses as observed in response to the first control parameter being maintained at the predetermined first value retrieved from the memory and (ii) the second value based on the received setpoint temperature, and
• control the plurality of second thermal control elements based on the calculated non-uniformities at the second value, wherein the at least one first thermal control element and the plurality of second thermal control elements are electrical thermal control elements, and wherein controlling the plurality of second thermal control elements includes controlling electrical setpoints of the plurality of second thermal control elements.