Semiconductor module having supporting portion for fastening portion inside a through hole in a resin case
AssigneeFuji Electric Co., Ltd.
InventorTatsuya Karasawa
Life of this patent
Estimating the term…
Abstract
A semiconductor module in which no crack of a metal film exists in a terminal is provided. A semiconductor module is provided, including: a semiconductor element; a terminal with a metal film formed on a surface and including a bent portion; a resin case to which the terminal is fixed and in which a through hole is formed opposite to the terminal, the resin case housing a semiconductor element; a fastening portion provided inside the through hole; and a supporting portion provided inside the through hole and supporting the fastening portion.
Claims11
A semiconductor module, comprising:
- a semiconductor element;
- a terminal with a metal film formed on a surface, the terminal including a bent portion;
- a resin case to which the terminal is fixed and in which a through hole is formed opposite to the terminal, the resin case housing the semiconductor element;
- a fastening portion provided inside the through hole;
- and
- a supporting portion provided inside the through hole and supporting the fastening portion, the supporting portion being formed of resin and including a fixing portion which fixes the supporting portion to the resin case, wherein
- a concave portion is formed in the supporting portion, the concave portion housing a bolt that joins the fastening portion, and
- a distance from an upper end of the supporting portion to a bottom portion of the concave portion is longer than a distance from the upper end of the supporting portion to the fixing portion.
A method of manufacturing a semiconductor module, comprising:
- preparing a terminal, the terminal plated and including a bent portion, and a resin case to which the terminal is fixed and in which a through hole is formed opposite to the terminal;
- inserting into the through hole a fastening portion and a supporting portion which supports the fastening portion, the supporting portion being formed of resin and provided with a concave portion to house a bolt that joins the fastening portion;
- fixing the supporting portion to the resin case, such that a distance from an upper end of the supporting portion to a bottom portion of the concave portion is longer than a distance from the upper end of the supporting portion to a portion where the supporting portion is fixed to the resin case;
- and
- housing and sealing a semiconductor element in the resin case.
A semiconductor module, comprising:
- a semiconductor element;
- a terminal with a metal film formed on a surface, the terminal including a bent portion;
- a resin case to which the terminal is fixed and in which a through hole is formed opposite to the terminal, the resin case housing the semiconductor element;
- a fastening portion provided inside the through hole;
- a supporting portion provided inside the through hole and supporting the fastening portion, the supporting portion including a fixing portion which fixes the supporting portion to the resin case;
- and
- a projecting portion provided on a surface between the supporting portion and the resin case, the projecting portion filling a gap between the supporting portion and the resin case upon being melted.
Dependencies are inferred from the claim text.